Features
- 5th/4th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Broadwell/Haswell)
- Onboard 4GB DDR3L (optional) and one SO-DIMM up to 8GB
- Max. up to 4 lanes of PCIe
- 4 SATA-600 ports
- 6 USB 2.0 and 2 USB 3.0
- TPM support
- LVDS and two DDI (DisplayPort/HDMI/DVI) with triple-view supported
Introduction
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
