Features
- LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor
- Intel® H310 chipset (Q370 optional)
- 2 DDR4 SO-DIMM for up to 64GB of memory
- 4 USB 3.0 and 4 USB 2.0 ports
- 2 COM ports
- 2 SATA-600, mSATA and M.2 Key M (NVMe)
- PCIe x4, M.2 Key E, PCI Express Mini Card slot
Introduction
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
